CyberC 2019 征稿: 第11届网络分布式计算与知识发现国际会议


CyberC 2019 征稿: 第11届网络分布式计算与知识发现国际会议

The 11th Int. Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery

Guilin, China, October 17 - 19, 2019Web:

Publication: IEEE (EI & Explore), Journal of Sensors (Selected Papers)

Submission Due Date: June 15, 2019


2019 Theme: Intelligent Cyberspace via the Convergence of AI, Big Data, 5G and Beyond


Technical Co-sponsors: IEEE, IEEE Computer Society, IEEE TCSIM (Technical Committee on Simulation), IEEE Communications Society (ComSoc) Technical Committee on Big Data (TCBD)

Organizer: Guilin University of Electronic Technology

Co-hosted by: Nanjing University of Posts & Telecommunications, Zhengzhou University, Peng Cheng laboratory

Sponsored by: Huawei, AT&T, InfoBeyond, Tech Mahindra


Scopes: CyberC promotes in-depth exploration of the most recent research and developments in the fields of AI, big data, distributed computing, clouds, cyber security, pervasive computing, mobile computing, Internet of Things, and other cyber-based technologies. Professors, scientists, engineers, and students in these areas are encouraged to participate. CyberC also welcomes industrial participations.  


Summits: CyberC 2019 co-hosts Emerging Technology Summit (AI, Big Data, 5G) forum that emphasizes innovative and state-of-art R&D, industry products, specifications, showcases, tutorial, technical transitions, and markets.


Cyber network and cybersecurity

• Cyber network, configuration, cloud, IoT, and wireless communications

• DDoS, Ransomware, and cybersecurity attacks and detection

• Multistage attacks, data security, AI and intrusion detection

• Risk assessment, management, and network monitoring

• Authentication and access Control

• Learning model for attack behavior, prediction, and game theory

• IoT and security

• Deploying machine learning and AI to enhance security and privacy

• Cybersafety and privacy

• Blockchain theory and its applications (smart grid, healthcare, ICS, etc.)

• Deploying machine learning and AI to enhance security and privacy

• Cybersafety and privacy, standardization, compliance and forensics

• Moving target defensing, image and target detection


Cyber Data and Analytics

• Big data algorithms, models, and systems for big data

• AI, Neural Network, Deep Learning

• Machine learning, and big data architecture and analytics

• Big data software design, middleware and analytics

• High performance computing, and intensive data networks

• Massive data streaming, scalable computing, big data task deployments

• Cloud and high performance computing for big data

• Data retrieval, storage, query, communications, and database

• Data preservation, filter, provenance, and assurance

• Data security, protection, integrity and privacy standards and policies

• Graph mining and opinion mining, and distributed data mining

• Data streaming, multimedia, stream, or web mining

• Image/multimedia data management

• Social media and social network analytics

• Security and information assurance for Big Data


Cyber and Distributed Computing

• Authentication, trust, privacy and other Cyber security issues

• Parallel and distributed algorithms, resource allocation, and load-balance

• Cloud computing, mobile cloud, mobility-aware cloud data/streams

• SOA, web services, and mobile services (software, infrastructure)

• Web services and internet computing

• Web-caching, content delivery systems and data distribution systems

• Distributed applications, modeling language, and software engineering

• Pervasive/ubiquitous computing and intelligence


5G and Mobile Computing

• Wireless networks, mesh networks, MIMO and 5G

• Industry control network, networking theory and algorithms

• Wireless embedded sensor systems, body sensor, smart cities & security

• Cognitive radio and SDR

• Future generation communications and pervasive computing

• Peer-to-peer network computing and overlaying networks

• Directional antenna and networking

• FDMA/OFDMA modulations, synchronization, and power optimization

• Mobile IP and Internet technology

• Key, attacking models, privacy, confidentiality & security in mobile networks

• Communication, services, middleware, and multimedia on wireless networks

• QoS, reliability, performance, and communication theory

• Wireless network simulations, implementation, and applications


Cyber Computing and Clouds

• Autonomic, real-time and self-organizing clouds

• Architectural models for public and private cloud computing

• Cloud resource management and allocation

• Utility models and service pricing

• New parallel / concurrent programming models for cloud computing

• Scientific computation and other applications in the cloud

• Mobility modeling, management and measurement for mobile clouds

• Mobile multimedia content delivery, transferring, and migration

• Content delivery networks using storage clouds

• User Experience and Cyber Security

• Performance evaluation, measurement and optimization

• Communications and network security

• Information security, software security, system security, or cryptography

• Tools, test-bed, simulations, and experimental environments

• Collaborative and cooperative environments

• QoS, Autonomic, reliability, and fault-tolerance



·         Big Data & AI 2019: The 6th International Workshop on Big Data and Artificial Intelligence, Chaired by Xiaolan Xie - Guilin University of Electronic Technology

·         Security 2019: The 7th workshop on Cyber Security and Privacy, Chaired by Yujue Wang - Guilin University of Electronic Technology, and Hongwei Li - University of Electronic Science and Technology of China

·         Blockchain 2019: The first workshop on Blockchain, Chaired by Bin Cao - Chongqing University of Posts and Telecommunications, and Lei Zhang - University of Glasgow

·         IOT 2019: The 3rd International Workshop on Internet of Things and Future Communication Technologies, Chaired Ning Cao - Sanming University



The CyberC 2019 Proceedings will be published by IEEE CPS. Full papers for CyberC 2019 must not exceed 10 pages of IEEE 2-column format, while short papers must not exceed 4 pages. Please visit the conference web site at for precise formatting and submission instructions.


Submission deadline for full (10-page) and/or short (4-page) papers: June 15, 2019

Notification of acceptance: July 20, 2019

Registration and Camera-ready: August 20, 2019



CyberC 2019 provides a special channel for you to submit your extended version to Journal of Sensors by MDPI. After submission of a CyberC version, you can submit an extended version to Journal all the time before December 30 2019: First submitted, first reviewed. Other journal information can be found at



David Lu - AT&T Labs, USA

Ya Zhou - Guilin University of Electronic Technology, China



Bin Xie - InfoBeyond Technology LLC, USA

Liang Chang - Guilin University of Electronic Technology, China



Chi-Ming Chen - AT&T Labs, USA

Chonggang Wang - InterDigital, USA



Yong Ding - Guilin University of Electronic Technology, China

Guangxia Xu - Chongqing University of Posts and Telecommunications, China

Ning Wang - Zhengzhou University, China



Bin Cao - Chongqing University of Posts and Telecommunications, China

Lei Zhang - University of Glasgow, United Kingdom

Xiaolan Xie - Guilin University of Technology, China

Hongwei Li - University of Electronic Science and Technology of China

Yujue Wang - Guilin University of Electronic Technology, China

Ning Cao - Sanming University, China



Xiaolong Xu - Nanjing University of Posts and Telecommunications, China



Bin Xie - InfoBeyond Technology LLC, USA



Jingwei Zhang - Guilin University of Electronic Technology, China

Zhenbing Liu - Guilin University of Electronic Technology, China



Sanjuli Agrawal - Indiana University Southeast, USA

Yingbing Yu - Austin Peay State University, USA



Bingyao Wang - Guilin University of Electronic Technology, China

Chengkai Kong - Nanjing University of Posts and Telecommunications, China

Chi Zhang - Zhengzhou University, China

Dandan Mao - Zhengzhou University, China

Linfeng Li - Chongqing University of Posts and Telecommunications, China

Lingfeng Shen - Zhengzhou University, China

Shuai Jiang - Nanjing University of Posts and Telecommunications, China

Wenyao Liu - Guilin University of Electronic Technology, China

Xufeng Liu - Zhengzhou University, China

Ye Zhang - Chongqing University of Posts and Telecommunications, China

Ze Li - Zhengzhou University, China

Zhengdong Li - Beijing University of Posts and Telecommunications, China



Anup Kumar (Chair) - University of Louisville, USA

Suryadip Chakraborty - Johnson C. Smith University, USA

Chi-Ming Chen - AT&T Labs, USA

Chih-Lin I - China Mobile, China

Yang Yang - ShanghaiTech University, China

Jiangzhou Wang - University of Kent, UK

Tzyh-Jong (TJ) Wang - AT&T Labs, USA



Ahmed H. Desoky - University of Louisville, USA

Ahmed Badi - Florida Atlantic University, USA

Alexandre Kandalintsev - University of Trento, Italy

AtillaElci - Aksaray University, Turkey

Atta urRehman Khan - University of Malaya, Malaysia

Antonio Abramo - University of Udine, Italy

Benoit Hudzia - SAP Research, UK

Bo Jiang - Intel, USA

Chen Qian - University of Kentucky, USA

Chukwuemeka David Emele - University of Aberdeen, UK

Dejing Dou - University of Oregon, USA

Ding-Yaeh Hung - WuFeng University, Taiwan

Donglin Wang - New York Institute of Technology, USA

Dorsaf Azzabi - Canadian University of Dubai, UAE

Haifeng Zheng - Fuzhou University, China

Hsung-Pin Chang - National Chung Hsing University, Taiwan

Hufeng Zhou - Brigham and Women's Hospital and Harvard Medical School, USA

Hui Lu - Beihang University, P.R. China

Huijuan Wu - University of Electronic Science and Technology of China, China

Cheng Chang - National DongHwa University, Taiwan

Jie Li - University of Tsukuba, Japan

Jing He - Kennesaw State University, USA

Jorg Dummler - Chemnitz University of Technology, Germany

Jun He - University of New Brunswick, Canada

Kai Bu - Zhejiang University, China

Lanxiang Chen - Fujian Normal University, China

Lin Wang - Xiamen University, China

Manar Ibrahim FawziHosny - King Saud University, Saudi Arabia

Man Ho Au - University of Wollongong, Australia

Maurizio Dusi - NEC Laboratories Europe, Germany

Min Wu - Oracle Corporation, USA

Mohammad Shoeb khan - University of Louisville, USA

Mahmoud Daneshmand - Stevens Institute of Technology, New Jersey, USA

Nicolas Sklavos - Technological Educational Institute of Patras, Greece

Nuno Vasco Lopes - University of Minho, Portugal

Omid Mahdi Ebadati E. - THamdard University, India

Rajdeep Bhowmik - Cisco Systems Inc., USA

Ricardo Lopes Pereira - INESC-ID/Instituto Superior Técnico, Portugal

Ricardo Rodriguez - Technological University of Ciudad Juarez, Mexico

Shanmugasundaram Hariharan - TRP Engineering College, India

Shui Yu - Deakin University, Australia

Song Cui - Stanford University, USA

Song Guo - The Hong Kong Polytechnic University, Hong Kong

SubinShen - Nanjing University of Posts and Telecommunications, China

Timothy W. Hnat - University of Memphis, USA

Vic Grout - Glyndwr University, UK

Wei-Da Hao - Texas A&M University-Kingsville, USA

Weirong Jiang - Xilinx, USA

Wei Yang - Jiangxi Normal University, China

Xian-Hua Han - Ritsumeikan University, Japan

Xinyu Que - IBM, USA

Yaser Jararweh - Jordan University of Science and Technology, Jordan

Zhan lin Ji - University of Limerick, Ireland

Zhefu Shi - Microsoft, USA

Zhengyu He - Google, USA



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